Abstract
Studies about the adsorption behavior of Cu(II) on D151 resin were conducted. Parameters including the effects of pH,
temperature, contact time and initial metal ion concentration were studied by batch methods. Results showed that the adsorption
was strongly dependent on pH of the medium, and the maximum uptake was obtained at pH 6.90. In the batch system, the D151
resin exhibited the highest Cu(II) uptake as 277.8 mg/g at 318K, calculated by the Langmuir model. The adsorption kinetics were
tested with Lagergren-first-order model, pseudo-second-order model and liquid film diffusion model. The adsorption data gave
better fits with Langmuir than Freundlich isotherm. Thermodynamic parameters indicated that the adsorption process was
spontaneous and it was endothermic in nature. Experimental column data fitted well with the Thomas model and it provide
possibility for process design. Cu(II) adsorbed on D151 resin can be eluted by 0.5mol/L HCl solution and the D151 resin can be
regenerated. Analysis of infrared spectra of resin both before and after adsorption of Cu(II) indicated the attendance of
coordination.